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Silicon Wafer Analyzer SWA 256 Series

Analysis of Standard sample (Hydrocarbon C16H34, C20H42)

Linearity of System Performance with standard sample Hydrocarbon C16H34, C20H42


Correlation Coefficient(n=3 Ave.)
n-Hexadecane C160.9998
n-Eicosane C200.9999

Distribution of recovery depending on the location of Si(cross section of dia.300mm)


Analysis of Standard sample (Phosphate)

SWA-256M Performance with standard sample (Siloxane D6, BHT, TCEP, DBP, DOP)

SWA-256M Performance with standard sample Linearity (Siloxane D6, BHT, TCEP, DBP, DOP)


Correlation coefficient (R2)
D6 : 0.999 BHT : 0.997TCEP : 0.994 DBP : 0.999DOP : 0.998

Wafer Box

1) Antioxidants
＊BHT→ 2,6-di-tert-butyl-p-Cresol
＊(Oxidized compounds of BHT)
a) 2,6-di-tert-butyl-p-Benzoquinone　　b) 2,6-di-tert-butyl-p-Methaquinone

2) Bridging materials
＊(Degradated compounds from Bis(t-butyl peroxi-isopropyl)benzene)
a) 1,3-Diisopropenylbenzene
b) p-Isopropenylacetophenone
c) Diacetylbenzene

3) Plasticizers
Phthalic acid ester <(COOR)2C6H6>
＊DBP→　Dibutyl phthalate ＊(Degradated compounds from DBP)
a) Phthalic anhydride
b) Butanol

＊DOP→　Di(2-ethyl-1-hexyl)phthalate ＊(Degradated compounds from DOP)
a) Phthalic anhydride
b) 2-ethyl-1-Hexanol
c) C8 hydrocarbons

4) Unknown
＊n-butyl-Benzenesulfonamide
＊2-Octylthiophene

Clean Room

1) Plasticizers
Phthalic acid ester <(COOR)2C6H6>
＊DBP→　Dibutyl phthalate
＊(Degradated compounds from DBP)
a) Phthalic anhydride
b) Butanol

＊DOP→　Di(2-ethyl-1-hexyl)phthalate
＊(Degradated compounds from DOP)
a) Phthalic anhydride 　
b) 2-ethyl-1-Hexanol
c) C8 hydrocarbons

＊DEP→ Diethyl phthalate
＊DMP, DIBP, DHP, BBP, DNP

Adipic acid ester < (CH2)4(COOR)2>
＊DBA→ Dibutyl adipate
＊DOA→ Di(2-ethyl-1-hexyl)adipate

2) FireRetardants
Phospheric esters
＊TCEP→ Tris(2-chloroethyl)Phosphate
＊TBP→ Tributylphosphate
＊TEP, TPP, TCP, TMCPP3

3) Sealants
Ring siloxanes Dn=[(CH3)2SiO]n>
＊Trimmers to 15-mers (D3 to D15)

4) Unknown
＊Unsaturated hydrocarbon (C16, C18)

Photolithography Process and Washing Process

Photolithography Process
1) HMDS→ Hexamethyldisilazane
＊(Degradated compounds from HMDS)
a) Trimethysilanol
b) ammonium(undetection)

2) Photo resist solvent
＊ECA→ 2-ethoxyethyl acetate

3) Developing reagent
＊(Degradated compounds from TMAH→ Tetramethylammoniumhydroxide)
a) Trimethylamine
b) Diethylformamide

Washing Process
＊IPA→ Isopropanol
＊Saturated hydrocarbons (C14～ C20)

Organic Contaminants on Si Wafer from Wafer box storage

Organic Contaminants on Si Wafer from Clean Room

 

Organic Contaminants in Clean Room

Organic Contaminants on Si Wafer fromClean Room