Products

TC-PLOT Series

TC-BOND S

TC-BOND S is a column bonded Divinylbenzene-4-vinylpyridine polymer. TC-BOND S is a medium polar column between TC-BOND Q and TC-BOND U, and is an optimal second choice column for the separation of non-polar and polar compounds.

  • Divinylbenzene-4-vinylpyridine polymer
  • Propylenes, ketones, esters and hydrocarbons
  • Medium polarity

TC-BOND S

  • Fused Silica
  • Equivalents : CP-PoraPLOT S, Rt-S-BOND

I.D.
Length
Film Thickness
Max. TemperatureQty.Cat.No.
0.25mm15m8µmiso.250℃-prog.250℃1pc1010-40811
0.25mm30m8µmiso.250℃-prog.250℃1pc1010-40813
0.32mm15m10µmiso.250℃-prog.250℃1pc1010-40821
0.32mm30m10µmiso.250℃-prog.250℃1pc1010-40823
0.53mm15m20µmiso.250℃-prog.250℃1pc1010-40841
0.53mm30m20µmiso.250℃-prog.250℃1pc1010-40843

TC-BOND S Metal

  • Stainless Column
  • Equivalents : MXT-S-BOND

I.D.LengthFilm ThicknessMax. TemperatureRemarkQty.Cat.No.
0.53mm30m20µmiso.250℃-prog.250℃Metal1pc1010-40893